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Uniformly embedded silver nanomesh as highly bendable transparent conducting electrode
This content has been downloaded from IOPscience. Please scroll down to see the full text. 2015 Nanotechnology 26 055305 (http://iopscience.iop.org/0957-4484/26/5/055305) View the table of contents for this issue, or go to the journal homepage for more
Download details: IP Address: 193.255.88.62 This content was downloaded on 16/01/2015 at 00:37
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Nanotechnology Nanotechnology 26 (2015) 055305 (8pp)
doi:10.1088/0957-4484/26/5/055305
Uniformly embedded silver nanomesh as highly bendable transparent conducting electrode Hak-Jong Choi, Soyoung Choo, Pil-Hoon Jung, Ju-Hyeon Shin, Yang-Doo Kim and Heon Lee Department of Materials Science and Engineering, Korea University, Anam-ro 145, Seongbuk-gu, Seoul 136-713, Korea E-mail: [email protected] Received 18 August 2014, revised 31 October 2014 Accepted for publication 22 December 2014 Published 15 January 2015 Abstract
Ag-nanomesh-based highly bendable conducting electrodes are developed using a combination of metal nanotransfer printing and embossing for the 6-inch wafer scale. Two Ag nanomeshes, including pitch sizes of 7.5 and 10 μm, are used to obtain highly transparent (approximately 85% transmittance at a wavelength of 550 nm) and electrically conducting properties (below 10 Ω sq−1). The Ag nanomeshes are also distinguished according to the fabrication process, which is called transferred or embedded Ag nanomesh on polyethylene terephthalate (PET) substrate, in order to compare their stability against bending stress. Then the enhancement of bending stability when the Ag nanomesh is embedded in the PET substrate is confirmed. Keywords: transparent conducting electrode, nanotransfer printing, Ag nanomesh, metal network, metal embedded structure (Some figures may appear in colour only in the online journal) 1. Introduction
sheet resistance [11–20]. Among these materials, metal-based TCEs demonstrate excellent performance with respect to electrical resistance and mechanical bending due to their intrinsic metallic properties [21]. In addition, high transmittance can be achieved by adjusting the open space between the metal structures. In particular, a metal nanomesh has the advantage of greater uniformity as compared with nanowire networks because of the periodic array of metallic nanostructures. However, bending of metals is limited on a polymer substrate due to poor adhesion between metals and polymers. Here we introduce a method for fabricating a Ag nanomesh embedded in a polymer substrate with a large area, which increases the resistance against bending stress. To compare the stability against bending stress, a transferred Ag nanomesh on a polymer substrate is also fabricated using nanotransfer printing, based on partial embossing. Then we confirm that the transmittance and sheet resistance are >80% and
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Journals
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My IOPscience
Uniformly embedded silver nanomesh as highly bendable transparent conducting electrode
This content has been downloaded from IOPscience. Please scroll down to see the full text. 2015 Nanotechnology 26 055305 (http://iopscience.iop.org/0957-4484/26/5/055305) View the table of contents for this issue, or go to the journal homepage for more
Download details: IP Address: 193.255.88.62 This content was downloaded on 16/01/2015 at 00:37
Please note that terms and conditions apply.
Nanotechnology Nanotechnology 26 (2015) 055305 (8pp)
doi:10.1088/0957-4484/26/5/055305
Uniformly embedded silver nanomesh as highly bendable transparent conducting electrode Hak-Jong Choi, Soyoung Choo, Pil-Hoon Jung, Ju-Hyeon Shin, Yang-Doo Kim and Heon Lee Department of Materials Science and Engineering, Korea University, Anam-ro 145, Seongbuk-gu, Seoul 136-713, Korea E-mail: [email protected] Received 18 August 2014, revised 31 October 2014 Accepted for publication 22 December 2014 Published 15 January 2015 Abstract
Ag-nanomesh-based highly bendable conducting electrodes are developed using a combination of metal nanotransfer printing and embossing for the 6-inch wafer scale. Two Ag nanomeshes, including pitch sizes of 7.5 and 10 μm, are used to obtain highly transparent (approximately 85% transmittance at a wavelength of 550 nm) and electrically conducting properties (below 10 Ω sq−1). The Ag nanomeshes are also distinguished according to the fabrication process, which is called transferred or embedded Ag nanomesh on polyethylene terephthalate (PET) substrate, in order to compare their stability against bending stress. Then the enhancement of bending stability when the Ag nanomesh is embedded in the PET substrate is confirmed. Keywords: transparent conducting electrode, nanotransfer printing, Ag nanomesh, metal network, metal embedded structure (Some figures may appear in colour only in the online journal) 1. Introduction
sheet resistance [11–20]. Among these materials, metal-based TCEs demonstrate excellent performance with respect to electrical resistance and mechanical bending due to their intrinsic metallic properties [21]. In addition, high transmittance can be achieved by adjusting the open space between the metal structures. In particular, a metal nanomesh has the advantage of greater uniformity as compared with nanowire networks because of the periodic array of metallic nanostructures. However, bending of metals is limited on a polymer substrate due to poor adhesion between metals and polymers. Here we introduce a method for fabricating a Ag nanomesh embedded in a polymer substrate with a large area, which increases the resistance against bending stress. To compare the stability against bending stress, a transferred Ag nanomesh on a polymer substrate is also fabricated using nanotransfer printing, based on partial embossing. Then we confirm that the transmittance and sheet resistance are >80% and
